1

Dicing

» Capability for dicing wafers up to 6 diameter and 25 mil thick.

» Capability to dice Silicon, GaAs, Ceramic substrates etc.

» Capable of dicing a minimum sheet width of 75-100 microns

2

Die bonding

» Both Epoxy and Eutectic die bonding under inert atmosphere

3

Cleaning

» Cleaning with Isopropyl alcohol, acetone after die bonding.

» Ultrasonic cleaning for the substrates and carriers

4

Wire Bonding

» Both Wedge and Ball bonding facility

5

Bond pull and die shear test facility

» Die-Shear test for chip as well as substrate up to 5Kg force

» Bond pull test for both Gold wire and ribbon

6

Parallel gap welder

» bonding gold ribbon up to 20 mil wide and 20 mil thick

7

Resistive welding

» Capable of welding Kovar and Stainless steel packages.

» Welding up to 8” x 8 “ size.

» Hermeticity of the order of 1 x 10 –8 atm cc/sec

8

Pressurization system

» Capable of pressurizing with fluro-carbons or helium.

9

Gross leak detector

» Bubble detection up to 10 –5 atm cc /sec

10

Fine leak detector

» Capability to detect leakage’s up to 1 x 10 –8  atm cc/sec

11

Soldering

» ESD grounded solder stations.

» Fume absorbers.